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Our precious metal thermocouples are internationally renowned for highly accurate and reliable temperature measurement.
An imine reductase (IRED) that catalyses the reductive amination of ketones with small aliphatic amines.
Johnson Matthey offers a complete range of rhodium compound catalysts for the hydroformylation reaction, including rhodium chloride, rhodium acetate or the original Wilkinson catalyst RhCl(PPh3)3.
Dimethyl formamide (DMF) is produced by reacting dimethylamine with carbon monoxide in the presence of a catalyst at low temperature and pressure in a specialised reactor. Johnson Matthey license the DAVY™ DMF process, which is well-proven commercially.
Aromatic and aliphatic primary amines can be obtained using our Transaminases
Gold-copper OROBRAZE™ filler metals show good wetting on Fe, Ni, Co, Ta, Nb and W.
Diamminedinitroplatinum(II) in ammoniacal solution | CAS: 14286-02-3
CAS Number: 1630734-20-1
CAS Number: 126251-92-1
For more than 20 years, many customers worldwide have successfully used HTC™ in solvents, fuels, white oils, waxes and other similar applications for de-aromatisation, desulphurisation and removal of undesirable and/or toxic aromatic and olefinic species from solvent streams using hydrogenation.
Tetrammine palladium(II) chloride solution | CAS: 13815-17-3
Our amination catalysts are used for a variety of speciality amines production and downstream of our oxo-alcohol catalysts.
CAS Number: 64536-78-3
EASY-FLO™ products are general-purpose silver brazing fluxes. They can be used on the common engineering metals including copper, copper alloys, nickel alloys, steel, stainless steel and tungsten carbide.
STOP-FLO™ No.1 and STOP-FLO No.2 are two stop-off or ‘parting’ compounds formulated to prevent the flow and wetting of molten brazing filler metal across the surface of a component during the brazing process.
The ARGENTEL™ range of products are designed for the brazing of steel or copper components and also for brazing steel to tungsten carbide in tooling applications.
See our range of lead-free, silver-lead, tin-lead and low-melting indium soft solders.
Potassium tetrachloroplatinate(II) | CAS: 10025-99-7
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